Chip Encapsulation
Effective dispensing of encapsulant materials is a key part of integrating chip-level components into the PCB environment. This may consist of relatively simple glob top dispensing of material to cover the entire component or complex dam & fill operations to build a precise perimeter around the component(s) before filling the cavity with encapsulant. Regardless of the complexity of the requirements, Asymtek systems provide the entire range of dispensing capabilities for any chip-on-board encapsulation challenge.
Videos
Dispensing Systems
- X-1020 Axiom™ Semiconductor Dispenser
- S-920 Spectrum™ Scalable Dispensing Solutions for Microelectronics Packaging
- S-820 Spectrum™ Precision Batch Semiconductor Dispenser
Pumps & Valves
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