Chip Scale Packages (CSP)
 CSP
Devices, when used in portable electronic equipment, have been found
to be more reliable when an underfill is used to encapsulate the
solder joints.
To build electronic assemblies in high volume requires high-speed,
precision dispensing. In many CSP applications, it is critical to
dispense precise volumes of fluid to provide protection for the
solder balls without wasting expensive encapsulation material. The
dispensing also needs to automatically compensate for changes in
fluid viscosity over the pot life of the material.
In addition, Asymtek offers a range of alternative underfill techniques,
including no-flow underfill
and jetting encapsulation technologies.
Contact us for additional information
regarding your process application.
Related Articles & Papers
Dispensing Systems
- X-1020 Axiom™ Semiconductor Dispenser
- S-820 Spectrum™ Precision Batch Semiconductor Dispenser
Jets, Pumps & Valves
- DJ-9000 DispenseJet® The Latest Jet Technology
- DP-3000 Linear Positive Displacement Pump
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