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Application Notes & Dispensing Tips


Conductive Adhesive Dispensing

Thermally and electrically conductive epoxy-based fluids are required to mechanically bond die to the substrate, to make an electrical ground plane connection, and to conduct heat away from the die. These fluids tend to have a short pot life and may be temperature sensitive. Fillers in these fluids are can easily clog.

Electrically conductive adhesives can be dispensed in dots or small lines to make electrical connections for hybrid components, solder replacement, RFID assembly, or MEMs devices. The use of electrically conductive adhesive is common in hard disk drive components, hearing aid components, and other electronics for medical devices.

Asymtek has developed production-proven platforms, jets, valves and pumps that take the worry out of dispensing conductive adhesives. Conductive adhesives, like silver epoxy, can be deposited by either jetting or standard needle dispensing, depending on the application. Contact Asymtek about your application.

Utilizing a dedicated Asymtek dispenser can enhance the speed of expensive die placement equipment delivering higher throughput. The exceptional accuracy of the amount of material dispensed can deliver significant cost-of-material savings. And, our proprietary Windows®-base software has the industry's most flexible set of parameters for line dispensing resulting in consistent, tail-free patterns.

Dispensing Systems

  • X-1010 Axiom SMT Dispenser
  • X-1020 Axiom Semiconductor Dispenser
  • S-910 Spectrum Scalable Dispensing Solutions for PCB Assembly and Microelectronics Packaging
  • S-820 Spectrum Precision Batch Semiconductor Dispenser

Pumps & Valves

  • DJ-9000 DispenseJet® The Latest Jet Technology
  • DP-3000 Linear Positive Displacement Pump
  • DV-7000 Heli-Flow® Pump
  • DV-8000 Heli-Flow® Pump

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