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Articles & Papers

The following documents are in Adobe Acrobat PDF format. We also have archived articles and papers available.

Printed Circuit Board Assembly and Surface Mount Technology

Advanced Solder Paste Dispensing - D. Ashley, S. Adamson (SMT Magazine, July 2008) (PDF 500 KB)

Corner and Edge Bond Dispensing for BGAs - A. Lewis (SMT Magazine, September 2007) (PDF 8 MB)

Process Control and Traceability in Automated Conformal Coating - A. Lewis, H. Pulido, P. Hogan (PCB & Assembly, June 2007) (PDF 179 KB)

Successful Jetting in SMT - D. Ashley, A. Lewis (SMT Magazine, May 2007) (PDF 278 KB)

Jetting - Dispense Technology of Choice for Adhesives - A. Lewis (SMT Magazine, March 2006) (PDF 322 KB)

Use of Closed-Loop Process Controls in Dispensing - J. Klocke (Circuits Assembly Magazine, January 2006) (PDF 467 KB)

Jetting Dispensing of Fluxes for Flip Chip Attachment and Measurement Methods for Ensuring Consistent Flux Coatings - S. Adamson, S. Heveron-Smith (Lumetrics) (IMAPS, Austin TX, June 2004) (PDF 258 KB)

Jetting Technology: A Way of the Future in Dispensing - H. Quinones, A. Babiarz, L. Fang (EMAP, Taiwan, October 2002) (PDF 170 KB)

Jetting Technology for Microelectronics - H. Quinones, A. Babiarz, L. Fang (IMAPS Nordic, Stockholm, Sweden September 2002) (PDF 197 KB)

Fluid Jetting for Next Generation Packages - H. Quinones, A. Babiarz, C. Deck (Pac Tech, Berlin, April 2002) (PDF 163 KB)

Practical Applications of Process Control in Conformal Coating - M. A. Reighard (Apex 2002, San Diego, CA January 2002) (PDF 798 KB)

Advantages of Non-Contact Dispensing in SMT Assembly Processes - A. F. Piracci (SMTA/ATE, Chicago, IL, September 2000) (PDF 91 KB)

Practical Production Applications for Jetting Technology - A. F. Piracci (APEX 2000, Long Beach, CA, March 2000) (PDF 992 KB)

Conformal Coating Process Controls: The Manufacturing Engineer's Aid - M. A. Reighard, N. A. Barendt (Nepcon West, Anaheim, CA, March 2000) (PDF 25 KB)

Advancements in Conformal Coating Process Controls - M. A. Reighard (APEX 2000, Long Beach, CA, March 2000) (PDF 2,775 KB)

Chip Scale Packaging, Encapsulation and Underfill

Eliminating Underfill Voids - A. Lewis (Advanced Packaging Magazine Sep 2005) (PDF 273 KB)

Paradigm Shift in Applying Underfill - A. Babiarz (Pan Pacific Jan 2005, Hawaii) (PDF 511 KB)

Jet Dispensing - The Underfill Solution - S. Adamson, T. Woods (SMT Magazine) (PDF 336 KB)

Jetting of Flux for Flip Chips - Jan 2005 - S. Adamson, T. Adams (Posted at EE Times Asia) (PDF 119 KB)

Jet Dispensing Underfills for Stacked Die Applications - S. Adamson (ATE 2004) (PDF 365 KB)

Board Design for Flip Chips and Chip-Scale Package Underfill - S. Adamson & T. Adams (Electronics Bulletin Hong Kong, Vol. 6, 2003) (PDF 658 KB)

Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces - S. Adamson (APEX 2004, Anaheim, CA) (PDF 230 KB)

Fluid Dispensing Capabilities for Assembly of MEMs - Alan Lewis, Steve Adamson, Lars M. Nielsen, Lisa Ryan (MEMS Sensor Packaging, Delta Denmark, March 2003 ) (PDF 190 KB)

Encapsulation Technology for 3D Stacked Packages - H. Quinones, A. Babiarz, L. Fang (ICEP/Microelectronics Tokyo, Japan April 2002) (PDF 210 KB)

Flip Chip, CSP and WLP Technologies: A Reliability Perspective - H. Quinones, A. Babiarz (Pac Tech, Germany, September 2001) (PDF 176KB)

Evaluation of Printed Circuit Board layout for Chip Scale Packages that Require Underfill and the Effect of Adjacent Passive Components - S. J. Adamson, J. J. Klocke, L. Nielsen (Pori Engineering Conference, Pori, Finland, September 2001) (PDF 136 KB)

Underfill Processes for Large-Small Flip Chip - A. Babiarz, H. Quinones, B. Ciardella (Pan Pacific, Kauai, HI, February 2001) (PDF 176 KB)

Advances in Fast Underfill of Flip Chips - A. Babiarz, H. Quinones (ICEP/Microelectronics, Tokyo, Japan, February 2001) (PDF 200 KB)

Design Considerations for High-Speed Underfill of CSP and Flip Chip Packages S. J. Adamson, J. J. Klocke (APEX Conference 2001, San Diego, California, January 2001) (PDF 159 KB)

Chip Scale Packaging Reliability - H. Quinones, A. Babiarz (EMAP, Taipei, Taiwan, November 2000) (PDF 202 KB)

Encapsulation of Large, Densely Populated Die with Small Gap - H. Quinones, T. Ratledge, D. Padgett, B. Huey (IMAPS UK, London, UK January 2001) (PDF 49 KB)

Fuel Cell, LED, Flat Panel Display

An Alternative Dispense Process for Application of Catalyst Films on MEA’s - A. Babiaraz, B. Sawatzky (SMTAI, August 2008) (PDF 376 KB)

Dispensing for the OLED Encapsulation Process - A. Babiarz (Solid State Technology, June 2008) (PDF 450 KB)

Silicone-Phosphor Encapsulation for High Power White LEDs - H. Quinones, B. Sawatzky, A. Babiarz (Pan Pacific, January 2008) (PDF 380 KB)

Advances in Jet Dispensing for Flat Panel Applications - T. Ratledge, R. Suriawidjaja (IMID, July 2006) (PDF 540 KB)

Jetting - A New Paradigm in Dispensing of Light Emitting Diode Products - B. Hoffman (IMAPS LED ATW, Oct 2005) (PDF 267 KB)

Life Sciences, Medical Electronics, Medical Device Assembly

Medical Device Assembly using Jet Dispensing for Underfill Applications - T. Woods & S. Adamson (SMTA, May 2004) (PDF 217 KB)

General

Innovative Dosierverfahren mit integrierter Prozessregelung - G. Schulze (EPP Magazine, September 2007 - in German) (PDF 361 KB)

Jetting Small Dots of High Viscosity Fluids for Packaging Applications - A. Babiarz (Semiconductor Packaging, August 2006) (PDF 700 KB)

Editor's Choice Best Product Award - Axiom™ Series - (Semiconductor International, July 2006) (PDF 322 KB)

The Use of Closed-Loop Process Controls in Dispensing Applications J. Klocke (ATE, Chicago, Sep 2005) (PDF 125 KB)

Jetting Technology in Automated Fluid Dispensing - A. Lewis (Assembly Tech Expo, Chicago, Sep 2005) (PDF 2 MB)

Flat Panel Assembly using Jet Dispensing for Gasketing Applications - T. Ratledge, R. Suriawidjaja, K. Fukunaga (International Display Workshop, Niigata, Japan) (PDF 877 KB)

Breadth of Dispensing Technologies Offers a Wide Variety of Conformal Coating Processing Capabilities - M. Szuch (IMAPS SoCal 2004) (PDF 431 KB)

Formulation Considerations for Automated Dispensing of Lead Free Solder Paste - A. Lewis (PDF 254 KB)

Jet Dispensing - A Paradigm Shift in Technology - S. Adamson (MEPTEC 2003) (PDF 220 KB)

Fluid Dispensing Processes for Next Generation Electronics - H. Quinones (Pan Pacific, Hawaii 2003) (PDF 196 KB)

Archived Articles & Papers